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November 17, 2022
Selective Solder Paste Printing for BGA Components
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function? Phil Zarrow and Jim Hall, The Assembly Brothers, answer these questions.
Board Talk
Stencil Aperture Design for Next Generation Ultra Fine Pitch Printing
The work reported here represents the start of a series of experiments to help further understand the significance of square vs circular aperture formats.
Production Floor
X-Ray Supports Quality Assurance, Counterfeit Detection
Be Selective in Partnering with a Soldering Equipment Supplier
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
Why the need for 3D SPI?
Dealing with the Results of the Pandemic
Direct Immersion Gold as a Final Finish
Essential Practices for Gold Mitigation of Electronic Components
Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
Solder Alloy Contribution to Robust Selective Soldering Process
Ask the Experts
How To Measure Solder Paste Rolling Diameter
A customer has asked us to measure the rolling diameter of solder paste while printing with our automated stencil printer. Is there a way to do this? What is the ...
Ask the Experts
Circuit Insight
Circuit Insight
Microchips for Future Computing Security
Microchips for Future Computing Security
Microchips with tiny clocks hold the key to future computing security, a system that is resistant to attacks, and also inexpensive, convenient, and scalable.
Technology Briefing
Embracing a New Paradigm: Electronic Work Instructions (EWI)
To stay competitive in today's evolving global marketplace, manufacturing must recognize and embrace the new EWI paradigm.
Analysis Lab
Circuit Insight
Circuit Insight
Characterization of Solder Pastes Based on Two Alternative Alloys
Characterization of Solder Pastes Based on Two Alternative Alloys
Characteristics of alloys, the development of flux media, solder pastes performance and solder joint reliability are discussed.
Materials Tech
SERDP Tin Whisker Testing and Modeling
The paper discusses testing and modeling program that aims to assess and quantify tin whisker growth on lead-free manufactured assemblies.
Production Floor
Circuit Insight
Circuit Insight
Ask the Experts
Legend Marking Discoloration
We are replacing LEDs damaged during the manufacturing process. During the rework process the legend surrounding the rework site, plus the legend indicating the part ...
Ask the Experts
Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Circuit Insight
Circuit Insight
What is the Suggested Humidity Level for Electronics Assembly?
What is the Suggested Humidity Level for Electronics Assembly?
I am aware of the suggested humidity level for an electronics assembly facility. Do the same limits apply within a 100,000 class clean room?
Board Talk
Selective Soldering with Alternative Lead-Free Alloys
We are still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling.
Materials Tech
Supplier Spotlight
MG Chemicals
Founded in 1955, M.G. Chemicals is a manufacturer and wholesaler ...
TDK Corporation of America
TDK Corporation of America (TCA), a group company of TDK ...
ACI Technologies, Inc.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated ...
BobWillis.co.uk
Bob Willis currently operates a training and consultancy business based ...
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Lightweight Foam Reflects Sunlight
Lightweight Foam Reflects Sunlight
Researchers designed a lightweight foam made from wood-based cellulose nanocrystals that reflects sunlight, emits absorbed heat and is thermally insulating.
Technology Briefing
Circuit Insight
Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
A technology featuring Copper Pillar Bond-On-Lead (BOL) with Enhanced processes delivers cost effective, high performance packaging solution.
Production Floor
Circuit Insight
Failure Analysis - Using Chromatography and Ion Chromatopgraphy/Mass Spec
From component and fabrication to complete electronic assemblies, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Analysis Lab
Circuit Insight
Danger on the Adhesive Coating Line
Danger on the Adhesive Coating Line
A plant worker adjusting rollers on an adhesive line suddenly began to act strangely. What caused the worker's spaced out appearance?
Mysteries of Science
Circuit Insight
Cartoon of the Day
Cartoon
"We forgot to back up our files, so we're asking everyone to remember everything they've typed during the past 10 days."
Copyright © Randy Glasbergen

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