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December 6, 2022

Calculating Failure Rate During Rework

Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, The Assembly Brothers, share their own insights to answer this question and offer their own suggestions.
Board Talk

Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Production Floor

Technical Papers

■	Master Advanced Packaging Inspection
■	Keys to Component Lead Tinning Success
■	X-Ray Supports Quality Assurance, Counterfeit Detection
■	Be Selective in Partnering with a Soldering Equipment Supplier
■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic
■	Direct Immersion Gold as a Final Finish
■	Essential Practices for Gold Mitigation of Electronic Components

How to Re-qualify BGA Spheres
What procedure would you recommend to "re-qualify" a lot of BGA spheres. We keep our spheres in a nitrogen cabinet, so I doubt that they would have degraded past the point ...
Ask the Experts

Demography AI and the Future of Economic Growth
Our lives are shaped by demographic and techno-economic trends. A demographically driven change intersects history’s techno-economic wave.
Technology Briefing

Reliability for High Temperature Power Computing
This experiment considers the reliability of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP.
Analysis Lab

Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech

The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor

Pick and Place Machine Calibration
In general how often should we calibrate pick and place machines, or run a placement machine process capability index Cpk test?
Ask the Experts

Quantifying Environmental Life Cycle Impacts for ICT Products
This paper describes a simplified approach for estimating the environmental impact of Information and Communications Technology (ICT) products.
Analysis Lab

Can Mixing Wave Solder Pallets Cause Contamination?
Our wave solder pallets are made from Durastone. Can we use the same wave solder pallets for leaded and lead-free?
Board Talk

Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste.
Materials Tech

Supplier Spotlight

Estatec
Estatec is a manufacturer and leading supplier of ESD products. ...

Electrolube
With our wide product range of formulated chemical products, we ...

Plasma Etch, Inc.
We have been satisfying our customers for over 27 years ...

Saki America, Inc.
Since its inception in 1994, SAKI has led the way ...

FULL SUPPLIER DIRECTORY

Get Ready for the Great 2020s Automation Surge
The world is in the midst of a cultural, technological, geopolitical and demographic transition. That transitional process is roiling our economy and our society.
Technology Briefing

Process Control and Reliability of Reworked BGA Solder Joint
This paper discusses the work done in identifying the key features for the right BGA rework equipment.
Production Floor

Silicon V-Groove Alignment Bench for Optical Component Assembly
In this paper, a Silicon Interposer is described that provides electrical interconnects to an edge emitting laser die and a laser monitor detector die.
Analysis Lab

Lubricant Causes Quality Problems
Cylinder locks coated with a light oil spray started to stick. Did a change in the process affect quality, and if so how?
Mysteries of Science

Cartoon of the Day

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