What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? Jim Hall and Phil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences. Board Talk
ESD and Humidification
In the handling of circuit board assemblies placing them into systems, is ambient air humidification necessary if other means of protection are enforced including ESD ... Ask the Experts
Conformal Coating Bubbles
We use a conformal coating house whose workmanship is beginning to display a ton of bubbles around the leads of the IC's. Per IPC-A-610 Rev G, section 10.8.2 ... Ask the Experts
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines. Production Floor
NSOP Reduction for QFN RFIC Packages
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes. Analysis Lab