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November 1, 2022
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints? Jim Hall and Phil Zarrow, also known as The Assembly Brothers, answer this question and share their own experiences.
Board Talk
Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor
X-Ray Supports Quality Assurance, Counterfeit Detection
Be Selective in Partnering with a Soldering Equipment Supplier
Effects of Long-Term Storage on Mechanical and Electrical Integrity
Selective Equipment in Spec?
Why the need for 3D SPI?
Dealing with the Results of the Pandemic
Direct Immersion Gold as a Final Finish
Essential Practices for Gold Mitigation of Electronic Components
Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
Solder Alloy Contribution to Robust Selective Soldering Process
Ask the Experts
ESD and Humidification
In the handling of circuit board assemblies placing them into systems, is ambient air humidification necessary if other means of protection are enforced including ESD ...
Ask the Experts
Circuit Insight
Circuit Insight
Neuromorphic Chip Runs Computations Directly in Memory
Neuromorphic Chip Runs Computations Directly in Memory
NeuRRAM neuromorphic chip brings AI closer to running on edge devices, performing tasks without relying on a network connection to a central server.
Technology Briefing
Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab
Circuit Insight
Circuit Insight
Challenges for Selecting Appropriate TIM2 Material for CPU
Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech
Assembly Process Feasibility of Low Silver Solder Paste
This paper presents performance/process capability of various low/no silver alloy solder pastes.
Production Floor
Circuit Insight
Circuit Insight
Ask the Experts
Conformal Coating Bubbles
We use a conformal coating house whose workmanship is beginning to display a ton of bubbles around the leads of the IC's. Per IPC-A-610 Rev G, section 10.8.2 ...
Ask the Experts
Solder Paste Inspection Tools to Support Industry 4.0 & Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability.
Analysis Lab
Circuit Insight
Circuit Insight
What is the IPC Definition for Uncommonly Harsh?
What is the IPC Definition for Uncommonly Harsh?
IPC 610 defines class three to include products where the end use environment may be uncommonly harsh. How is uncommonly harsh defined?
Board Talk
Liquid Dispensed Thermal Materials for High Volume Manufacturing
This paper presents the science behind liquid TIMs identifies key TIM characteristics needed to design and manufacture reliably and efficiently.
Materials Tech
Supplier Spotlight
Production Solutions, Inc.
Established in 1998 as an engineering, design and manufacturing company, ...
EMC Global Technologies, Inc.
EMC Global Technologies, Inc. is a privately held company located ...
PACE Worldwide
PACE Worldwide has been providing the most innovative, cost-effective solutions ...
A-TECH Circuits Co., Ltd.
A-TECH CIRCUITS CO.,LIMITED is a contract PCB (Printed circuit board) ...
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Hydrogen As an Efficient Form of Energy
Hydrogen As an Efficient Form of Energy
Hydrogen is an efficient form of energy when used in fuel cells to generate electricity. Transporting and storing hydrogen has its own set of problems.
Technology Briefing
Circuit Insight
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor
Circuit Insight
NSOP Reduction for QFN RFIC Packages
NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes.
Analysis Lab
Circuit Insight
Brighter Chrome on the Third Shift
Brighter Chrome on the Third Shift
Why was one third shift operator at a plating shop producing parts with a superior chrome finish compared to the other two shifts?
Mysteries of Science
Circuit Insight
Cartoon of the Day
Cartoon
"I can see you need more time to make up your mind..."
Copyright © Randy Glasbergen

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