Circuit Insight

Electronics Assembly Knowledge, Vision & Wisdom

HOME

RESEARCH

SUPPLIERS

SUBSCRIBE

October 18, 2022

Simple Test for Flux Penetration

What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? Sharing their own experiences in the industry, a simple method is offered by the Assembly Brothers, Jim Hall and Phil Zarrow.
Board Talk

Lean Flow on the SMT Factory Floor
How can a Lean, agile SMT operation be sustained by turning existing engineering programming and planning functions "upside down"?
Production Floor

Technical Papers

■	Be Selective in Partnering with a Soldering Equipment Supplier
■	Effects of Long-Term Storage on Mechanical and Electrical Integrity
■	Selective Equipment in Spec?
■	Why the need for 3D SPI?
■	Dealing with the Results of the Pandemic
■	Direct Immersion Gold as a Final Finish
■	Essential Practices for Gold Mitigation of Electronic Components
■	Nearshoring or Contract Manufacturing? Which Fits Your Business Model?
■	Solder Alloy Contribution to Robust Selective Soldering Process
■	The Four Roles of Inspection Data in a Smart Factory

Requirements for Installing Leaded vs. Lead-free Press Fit Connectors
Is there a difference between the requirements to install a leaded press fit connector, and a lead free press fit connector?
Ask the Experts

Microchips for Future Computing Security
Microchips with tiny clocks hold the key to future computing security, a system that is resistant to attacks, and also inexpensive, convenient, and scalable.
Technology Briefing

Effects of Substrate Material and Package Pad Design on Solder-Joint Reliabilty
This paper describes work to improve the solder-joint reliability (SJR) of a 0.8mm pitch, 25mm body BGA package used in automotive under-the-hood applications.
Analysis Lab

Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech

EMI-Caused EOS Sources in Automated Equipment
This paper analyses sources of EMI-Caused EOS noise, how it affects components and how to mitigate this problem.
Production Floor

Solution for Grape Effect
We are processing lead-free boards with large components that require high peak temperatures and slow conveyor speeds in a reflow oven that does not use ...
Ask the Experts

Evaluation of High Speed Plating for Copper Post with Flat Top Shape
In developing high-speed electro “copper post” plating bath the shape of the post and the uniformity of the post height throughout the wafer were considered.
Analysis Lab

BGA Components and Coplanarity
We have a PCB with a HASL surface finish, the assembly includes a 256 ball BGA. The component balls are .6 mm pitch. Is coplanarity a concern?
Board Talk

BVA: Molded Cu Wire Contact Solution
This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Materials Tech

Supplier Spotlight

Metrohm USA
Metrohm is one of the world’s most trusted manufacturers of ...

MicroCare, LLC
MicroCare is based in New Britain, Connecticut, USA, which is ...

Mycronic AB
Mycronic is a Swedish high-tech company that has been active ...

Solderstar LLC
Solderstar is one of the world’s leading thermal profiling solution ...

FULL SUPPLIER DIRECTORY

A Future 3D Printing Robots
3D printers could churn out devices that are more flexible, dynamic and potentially more useful. The results could include wearable electronic devices and more.
Technology Briefing

SN-CU-NI Composite Solder Paste High Temperature Use
Research on a prototype paste is being completed to improve reliability and survivability of PCB and SMT solder joints under extreme temperatures (< 500° Celsius).
Production Floor

Solder Composition, Surface Finish and Solder Joint Volume on Drop Shock Reliability
Five Pb-free solder alloys on two PCB surface finishes were evaluated for drop shock reliability with two different solder joint volumes (LGA and BGA).
Analysis Lab

The Hot Chip Scale Package
A team building the world's first high-density Chip Scale Package needed to get it out the door. It was still hot when it shipped.
Mysteries of Science

Cartoon of the Day

This email was sent to <<Email Address>> - Unsubscribe

Add us to your address book